Thermal conductivity up to 1800–2200 W/(m·K)
SINGLE CRYSTAL DIAMOND
single-crystal diamond
Single Crystal Diamond
MPCVD-grown single-crystal diamond in standard plate sizes from 7×7 mm to 25×25 mm, for high-performance electronics and functional materials. A materials platform for heat spreading in high-heat-flux devices and for advanced device R&D and validation.
QS / PRODUCT PLATFORM
MPCVD
01 / PRODUCT OVERVIEW
Product overview
Single-crystal diamond is grown by MPCVD (microwave plasma chemical vapor deposition) as a functionally uniform diamond material with a single crystal orientation—distinct from particle-dispersed or polycrystalline structures.
The product is currently offered primarily as plates (square/rectangular, millimeter-scale), with circular (wafer-like) forms also available. It can be used as a standalone high-performance functional substrate, or as a base material for subsequent metallization, packaging, or device integration (for example, copper- or aluminum-metallized diamond composite products use single-crystal diamond as the core crystal).
01
MPCVD growth
02
single-crystal diamond
03
Precision machining
04
Metallization / packaging
05
Device applications
02 / MATERIAL CHARACTERISTICS
Crystal characteristics
single-crystal diamond
Extremely low CTE
Mohs hardness 10
Excellent chemical stability
No grain boundaries; thermal, electrical, and mechanical consistency better than polycrystalline materials
03 / SPECIFICATIONS
Crystal orientation / form / size / thickness
Standard plate sizes
7×7mm
8×8mm
10×12mm
11×13mm
13×15mm
15×15mm
25×25mm
THICKNESS
0.3–5mm
| Item | Specification | Notes |
|---|---|---|
| Crystal orientation (polished face) | Available on request | Diamond is cubic. Common orientations are (100), (110) and (111); the exact orientation and off-angle are confirmed by measurement. |
| Form | Plate (square or rectangular, the main form); round wafer is a smaller share | Plate is the current main supply form |
| Standard plate sizes | 7×7mm, 8×8mm, 10×12mm, 11×13mm, 13×15mm, 15×15mm, 25×25mm | Standard size series; other sizes are available on request |
| Round (wafer) sizes | Available on request | Specific sizes can be confirmed through a technical inquiry |
| Thickness | 0.3–5mm | Standard thickness range for plates |
04 / TECHNICAL HIGHLIGHTS
Material parameters
1800–2200
W/(m·K)
Thermal conductivity
1.0–1.5
10⁻⁶/K
Thermal expansion coefficient
3.51–3.52
g/cm³
Density
10
—
Mohs hardness
| Item | Unit | Value | Notes |
|---|---|---|---|
| Thermal conductivity | W/(m·K) | 1800–2200 | Reference value for high-quality CVD single-crystal diamond; the lot inspection report governs |
| Thermal expansion coefficient | 10⁻⁶/K | 1.0–1.5 | Reference value for CVD single-crystal diamond |
| Density | g/cm³ | 3.51–3.52 | Physical constant of diamond |
| Mohs hardness | — | 10 | Intrinsic property of diamond |
| Tensile strength | MPa | Available on request | No product-specific confirmed value yet; do not reuse copper-clad sheet figures |
| Young's modulus | GPa | 900–1100 (industry reference) | Published industry reference range |
| Dielectric constant / dielectric loss | — | Available on request | Product-specific test figures are available on request |
| Volume resistivity | Ω·cm | >10¹⁴ (industry reference) | Published industry reference range |
| Surface roughness (front/back Ra) | nm | Front Ra ≤1.16 (measured on a sample) | Historical third-party reference from a February 2025 15×15 mm plate lot, not a fixed spec for current lots |
| Warp / flatness | μm | Sa ≈0.56 (historical reference) | Historical third-party reference from a February 2025 15×15 mm plate lot, not a fixed spec for current lots; see the inspection file |
| Optical transmittance / refractive index | — | Not applicable | Optical-grade figures are on the Diamond Optical Window product |
05 / PROCESSING CAPABILITY
Processing capability
STEP 01
Custom crystal morphology, form (plate/circular), size, and thickness supported; processing scope confirmed against capacity and requirements.
STEP 02
Polishing, cutting, and other secondary processing available; process and accuracy metrics can be further confirmed to customer requirements.
STEP 03
For specific crystal orientation, purity grade, or surface finishing, submit requirements via technical inquiry for R&D feasibility assessment.
06 / APPLICATIONS
Application fields
High-heat-flux heat spreading and cooling validation (power semiconductors, RF/microwave devices, and related directions)
High-performance device validation and frontier R&D (ultra-wide-bandgap semiconductors, thermal-management materials, optoelectronic materials, and related directions)
Base materials platform for materials evaluation, process development, and prototype validation
Core crystal feedstock for subsequent metallization/packaging products (e.g., copper- or aluminum-metallized diamond)
07 / QUALITY & VALIDATION
Inspection documentation
In February 2025, our technology partner commissioned the Shenzhen Institutes of Advanced Technology (SIAT), Chinese Academy of Sciences, to perform third-party testing on a 15×15 mm plate single-crystal diamond sample. The tests covered wafer-level surface roughness and bow: front-side Ra = 0.7774–1.158 nm, back-side Ra = 22.096 nm, bow Sa = 0.5628 μm. The conclusion was "qualified, meeting wafer-level criteria (under the international convention that Ra < 3 nm is considered wafer-level)."
This data is from early-2025 sample submissions and does not fully correspond to current equipment and process lots; it is historical process-capability reference only and does not represent fixed outgoing parameters for current lots.
For latest inspection data or lot-specific reports, request via "Technical inquiry"; Quality will confirm and provide as appropriate.
08 / WHERE IT FITS
Matching solutions
01
Power semiconductor thermal-management solutions
For high-heat-flux heat spreading and high-performance validation scenarios
Explore solutions → 02RF and microwave device thermal-management solutions
For high-heat-flux RF heat spreading and validation scenarios
Explore solutions → 03Laser and optoelectronics thermal-management solutions
For high-heat-flux heat spreading and high-performance validation scenarios
Explore solutions → 04Diamond materials R&D and validation platform
For high-performance device validation and frontier R&D
Explore solutions →CONTACT
Technical inquiry
Standard specs: plates 7×7 mm, 8×8 mm, 10×12 mm, 11×13 mm, 13×15 mm, 15×15 mm, 25×25 mm, thickness 0.3–5 mm; circular (wafer-like) sizes available on request
Customization: crystal orientation, form (plate/circular), surface finishing, purity grade, non-standard size and thickness—all available on request